As semiconductor nodes shrink below 2nm, manufacturers face rising demands on yield, defect control, and reliability. Traditional coating technologies such as Ionized Metal Plasma (IMP), Magnetron Sputtering, and Plasma-Enhanced Chemical Vapor Deposition (PECVD) are reaching their limits.
NTI Nanomaterials introduces Filtered Cathodic Vacuum Arc (FCVA) based coatings for advanced packaging and backend processes.

Supporting your coating needs at every stage of the process
🟦 High-Volume Resistance
• Protects lead frames during reflow/bake
• Reduces cracking, delamination, and downtime
🟦 Bonding Yield Protection
• Extends wire bond shelf life and adhesion
🟦 ESD Control
• Prevents static buildup on solder ball templates
• Enables clean, precise placement
🟦 Water Resistance
• Enhances plastic encapsulation durability
• Cuts replacements and repairs under warranty
🟦 Chemical Resistance
• Shields elastomer seals from abrasion and corrosive agents
• Extends life of machine cleaning devices