ICP電漿清洗機

SIC 燒結機 ISO BONDER

晶圓Die Saw膠帶貼膜機 Wafer Mounter

晶圓背面貼膜機 Back Side Lamination

晶圓轉Cassette 機 Wafer Sorter

E-Beam Lithography System 電子束影顯微系統

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晶圓BG膠帶貼膜機/撕膜機 BG Tape/ Detap

ALD 原子積層塗佈設備

Diffusion Furnace 擴散爐

3D 立體掃描顯微鏡 3D- SEM

表面張力分析儀 接觸角 Surface Tension Analysis System, Contact Angle

全光譜橢偏儀 測厚儀 Spectroscopic Ellisometer, Spectroscopic Reflectometer

表面張力分析儀 接觸角 Surface Tension Analysis System, Contact Angle

300SA Semi-Auto Prober

Multi-Site Parallel Wafer-Level Probing System

MIRA-Package & wafer-level Mulit-Application testing

ACE-Package level pulse EM and BTS testing

EM or BTS Full AC Version

Infinity-Package & wafer-level TDDB & HC testing

雷射切割機 Laser Dicing System

Wafer Sorting, Packing, Unpacking 晶圓分片 包裝 拆裝機

Wafer Macro & Micro Optical Inspection 晶圓外觀檢測機

3rd Optical Inspection System 第三光學檢測機

Wafer UV Eraser 晶圓UV紫外光清除機

超音波 鋁片/銅片 接合機 Ultrasonic Metal-S Bonder

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超音波 鋁/銅線 銲接機 Ultrasonic Wire Bonder

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Sorter With unicon Visual Inspection System 晶粒挑選測試機

WLCSP die sorter with 5S vision check 晶粒外觀分選機

Beatrum 非接觸 噴射點膠機

Non-Contact Dispenser 非接觸式點膠系統

Die & Wire Bonder 黏晶機 打線機

Wind Tunnel, Still Box, Thermal test wafer 風洞, 靜置箱, 熱組測試晶片

風洞,靜置箱, 熱組測試晶片

Bonding Pad/Metal Stamping

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打線墊片/預成型金屬片

Bonding Wires (Au, Al, Cu, Ag)

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打線機/貼片機用線材

Diffusion Paper, SOD, SOG

擴散源 (磷紙, 硼紙, 旋佈式液態源, 固態源)

Ink Marking Consumables 油墨蓋印耗材

Solder Preform

焊片

Megasonic Generator/ Transducer

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MicroE Encoder

Feedthrough, Thermocouple, Viewport, …

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電引入, 熱電耦, 視窗等真空專用接頭

Precision Motor, Linear Actuator

Bonding Wedge

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打線鋼嘴

Bellows Valve, Diaphragm Valve, Check Valve

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Dispensing Component

點膠針筒、耗材

IC Test / Burn in Socket IC 手測 / Burn in 測試座

3500種SOCKET產品,最小間距(PITCH)0.22 MM 各類QFN,CSP,BGA, TO, SOIC SOCKET

Burn In boards / Load boards

Contact Pin Assembly 測試金手指

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PaTa-Gun 高效能噴氣槍